ENGINEER VI - Mixed Signal Lead System Integration Engineer
Located in Malibu, California, HRL has been on the leading edge of technology, conducting pioneering research and advancing the state of the art.
EDUCATION DESIRED: MS or Ph.D. in Electrical Engineering, Physics, Material Science, or related scientific discipline.
ESSENTIAL JOB FUNCTIONS:
The Mixed Signal Solutions department at HRL Laboratories is a highly talented team of scientists and engineers with diverse backgrounds in integrated circuit design, advanced packaging and integration, novel signal processing and algorithm development, and integration / characterization of highly complex digital and mixed signal systems and subsystems for commercial and government applications in an innovative research and development environment. We seek an experienced candidate capable of technical and programmatic leadership of several R&D efforts focused on development, demonstration, and maturation of novel interconnect and integration techniques applied to high performance mixed signal systems. The successful candidate will enable revolutionary compact, high speed, high dynamic range system concepts through development of aggressive integration techniques involving a combination of commercial technologies (e.g. fine pitch laminate and ceramic packages and PCBs, silicon interposers, WLFO) and customized solutions leveraging in-house wafer level processing and flip-attach bonding. This Lead Engineer role will require attention to tradeoffs involving all facets of system development (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability / cost constraints, etc.) and involving theory-driven analyses of candidate approaches. Must organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Must provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Must develop and maintain relationships with relevant vendors and partner organizations, as well as with other internal leads and teams working on other system elements. Must have excellent communications skills, organizing and presenting results in written reports and oral presentations. Must create and manage work plans to meet or exceed schedule deadlines and technical expectations. Must lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.
More than 10 years of experience in design and integration of high performance mixed signal systems, with a particular emphasis on interconnect / integration. More than 10 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new interconnect / integration technologies. Demonstrated experience developing external partnerships and vendor relationships. More than 5 years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. Familiarity with commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques. Familiarity with typical mixed signal systems and components (transmitters, receivers, ADCs, DACs, amplifiers, mixers, RF and microwave components, etc.) and associated tradeoffs in one or more application spaces (RADAR, comms, EW, imaging, etc.)
Basic background knowledge across all domains relevant to mixed signal systems (e.g. thermal-mechanical design, integrated circuit design, semiconductor processing and associated material science, control system theory, etc.) with deeper background knowledge in areas specifically relevant to interconnect / integration within such systems (e.g. electromagnetic modeling, signal integrity, interconnect fabrication and characterization at chip level, package level, PCB level, system level). Familiarity with metrics and methods used to characterize high speed electrical interconnects. Familiarity with standard system engineering practices and terminology. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS:
Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS (e.g. driver’s license, special tools or restrictions):
U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Must have an active SSBI.
HRL offers a very competitive compensation and benefits package. Our benefits include medical, dental, vision, life insurance, 401K match, gym facilities, PTO, growth potential, and an exciting and challenging work environment.
HRL Laboratories is an Equal Employment Opportunity employer and does not discriminate in recruiting, hiring, training or promoting, on the basis of race, ethnicity, color, creed, religion, sex, sexual orientation, gender, gender identity, genetic information, national origin, physical or mental disability, pregnancy, medical condition, U.S. military or protected veteran status, union membership, or political affiliation. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA